Thermally conductive adhesives and potting compounds epoxies etc.
Thermally conductive epoxy potting.
It is a low viscosity alternative to er2220 system which is ideal for potting and encapsulating electronics or components with limited spacing and.
Formulated with various different conductive fillers our products are designed to offer maximum thermal.
Pigmented black for excellent thermal absorption and emission.
3m thermally conductive epoxy adhesive tc 2707 is a thermally conductive 2 part epoxy using aluminum metal fillers for good thermal conductivity with high adhesion.
A thermally conductive epoxy epoxy resin for use with hardeners b thermally conductive epoxy epoxy hardener for use with resins safety data sheets for each part listed above follow this cover sheet.
Epic s7133 has been designed with a convenient 1 1 mix ratio by weight or volume and uses a less abrasive filler making s7133 suited for meter mix dispense applications.
Epoxyset specializes in manufacturing highly engineered thermally conductive potting compounds.
Is a leading manufacturer of thermally conductive epoxies urethanes and silicones.
Er2183 thermally conductive epoxy potting compound is an epoxy resin which meets ul94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission.
A black electrically isolating thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies transformers and coils.
Low viscosity for potting application.
Good thermal conductivity 0 72 w m k low cl ion content and outgassing.
Transportation instruction before offering this product kit for transport read section 14 for all parts listed above.
Our chemists and application engineers have developed polymer formulations that provide various cure schedules viscosities and fast continuous heat dissipation for a variety of electronic and.
Good thermal conductivity 1 0 1 4 w m k low cl ion content and outgassing.
3m thermally conductive epoxy adhesive tc 2810 is a thermally conductive 2 part epoxy using boron nitride bn filler for good thermal conductivity with high adhesion.
Formulated with undiluted bis f resin for superior physical properties and pigmented with high purity aluminum oxide pigment to provide excellent thermal conductivity at reasonable cost.
Our products range from room temperature cure to high temperature and vary in viscosities to suit your application.
Thermally conductive epoxy encapsulating and potting compound.
